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DFM1200FXM12-A000
DFM1200FXM12-A000
Fast Recovery Diode Module Preliminary Information
DS5480-1.2 July 2001
FEATURES
s Low Reverse Recovery Charge s High Switching Speed s Low Forward Voltage Drop s Isolated Base s Dual Diodes Can Be Paralleled for 2400A Rating s MMC Baseplate With AlN Substrates
KEY PARAMETERS VRRM VF (typ) (max) IF (max) IFM
1200V 1.9V 1200A 2400A
External connection 1(C1) 2(C2)
APPLICATIONS
s Chopper Diodes s Boost and Buck Converters s Free-wheel Circuits s Snubber Circuits s Resonant Converters s Induction Heating s Multi-level Switch Inverters The DFM1200FXM12-A000 is a dual 1200 volt, fast recovery diode (FRD) module. Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. Fast switching times and low reverse recovery losses allow high frequency operation making the device suitable for the latest drive designs employing pwm and high frequency switching. These modules incorporate electrically isolated base plates and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety.
3 1
3(A1)
4(A2)
External connection
External connection for single 2400A diode application Fig. 1 Circuit diagram
4
2
ORDERING INFORMATION
Order As:
DFM1200FXM12-A000
Note: When ordering, please use the complete part number. Outline type code: F (See package details for further information) Fig. 2 Electrical connections - (not to scale)
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DFM1200FXM12-A000
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25C unless stated otherwise Symbol VRRM IF IFM I2t Pmax Visol Qpd Parameter Repetitive peak reverse voltage Forward current (per arm) Max. forward current I2t value fuse current rating Maximum power dissipation Isolation voltage Partial discharge Tvj = 125C DC, Tcase = 75C Tcase = 110C, tp = 1ms VR = 0, tp = 10ms, Tvj = 125C Tcase = 25C, Tvj = 125C Commoned terminals to base plate. AC RMS, 1 min, 50Hz IEC1287. V1 = 1200V, V2 = 900V, 50Hz RMS Test Conditions Max. 1200 1200 2400 200 5000 4 10 Units V A A kA2s W kV pC
THERMAL AND MECHANICAL RATINGS
Internal insulation: Baseplate material: Creepage distance: Clearance: CTI (Critical Tracking Index): AlN AlSiC 20mm 10mm 175 Test Conditions Continuous dissipation junction to case Rth(c-h) Thermal resistance - case to heatsink (per module) Tj Tstg Junction temperature Storage temperature range Screw torque Mounting - M6 Electrical connections - M8 Mounting torque 5Nm (with mounting grease) -40 125 125 5 10 C C Nm Nm 8 C/kW Min. Typ. -
Symbol Rth(j-c)
Parameter Thermal resistance - diode (per arm)
Max. 20
Units C/kW
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DFM1200FXM12-A000
STATIC ELECTRICAL CHARACTERISTICS - PER ARM
Tvj = 25C unless stated otherwise. Symbol IRM VF Parameter Peak reverse current Forward voltage Test Conditions VR = 1200V, Tvj = 125C IF = 600A IF = 600A, Tvj = 125C L Inductance Min. Typ. 1.9 2.1 20 Max. 20 2.2 2.4 Units mA V V nH
STATIC ELECTRICAL CHARACTERISTICS
Tvj = 25C unless stated otherwise. Symbol LM Parameter Module inductance (externally connected in parallel) Test Conditions Min. Typ. 15 Max. Units nH
DYNAMIC ELECTRICAL CHARACTERISTICS - PER ARM
Tvj = 25C unless stated otherwise. Symbol Irr Qrr Erec Parameter Peak reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions IF = 1200A, dIF/dt = 9000A/s, VR = 600V Min. Typ. 800 200 80 Max. Units A C mJ
Tvj = 125C unless stated otherwise. Symbol Irr Qrr Erec Parameter Peak reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions IF = 1200A, dIF/dt = 8400A/s, VR = 600V Min. Typ. 920 300 140 Max. Units A C mJ
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DFM1200FXM12-A000
TYPICAL CHARACTERISTICS
3200 2800 2400
Forward current, IF - (A) 100
Transient thermal impedance, Zth (j-c) - (C/kW )
Tj = 25C
Tj = 125C
2000 1600 1200 800 400 0 0 0.5 1 1.5 2 2.5 Forward voltage, VF - (V) 3 3.5
10
1 0.001
1 2 3 4 Ri (C/KW) 0.8 2.7416 3.4916 12.9568 i (ms) 0.0066332 1.4384 12.8758 110.2138 0.01 0.1 Pulse width, tp - (s) 1 10
Fig. 2 Diode typical forward characteristics
Fig. 4 Transient thermal impedance
6000
2000 1800
5000
Power dissipation, Ptot - (W)
1600
DC forward current, IF - (A)
1400 1200 1000 800 600 400
4000
3000
2000
2000
200
0 0
20
40 60 80 100 120 Case temperature, Tcase - (C)
140
160
0 0
20
40 60 80 100 120 Case temperature, Tcase - (C)
140
160
Fig. 5 Power dissipation
Fig. 6DC current rating vs case temperature
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DFM1200FXM12-A000
1400
1200
Reverse recovery current, Irr - (A)
1000
800
600
400
200 Tj = 125C 0 0 200 600 400 800 Reverse voltage, VR - (V) 1000 1200
Fig. 7 RBSOA
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DFM1200FXM12-A000
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 62 15 15 62
3
1 57
4
2
20 4x M8
5 140 Main Terminal screw plastic hole depth (M8) = 16.8 0.3 Copper terminal thickness, main terminal pins = 1.5 0.1 Nominal weight: 1050g Module outline type code: F
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31.5
38
43.3 57 65 6x O7
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DFM1200FXM12-A000
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2001 Publication No. DS5480-1 Issue No. 1.2 July 2001 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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